Bonded structure

ABSTRACT

A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of International Patent ApplicationNo. PCT/JP2006/312165, having an international filing date of Jun. 16,2006, which designated the United States, the entirety of which isincorporated herein by reference. Japanese Patent Application No.2005-178613 filed on Jun. 17, 2005 is also incorporated herein byreference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a bonded structure obtained by bondinga plurality of structures, a microstructure, and a microproduct.

It is particularly effective to apply the invention to a microstructureand a microproduct used in the fields of biochemistry, biotechnology,optics, electrics and electronics, and the like, such as amicromechanical switching element, microoptics, a microfluid, amicrochemical reactor, a microbioreactor, a microdevice, a microchannel,and a microwell array chip.

As a method of forming a microchannel through which a sample or areactive liquid is caused to flow, a method has been studied whichincludes providing a plurality of structures, forming a two-dimensionalor three-dimensional open microstructure such as an open channel or anopen hole in at least one of the structures, and bonding the otherstructure having a flat and smooth surface to the structure in which theopen microstructure is formed to obtain a microstructure.

For example, Japanese Patent No. 3515784 discloses technology ofapplying to bonding surfaces of structures a solution prepared bydissolving a material having a melting point lower than that of thestructures in a solvent, removing the solvent, and bonding thestructures by heating. However, an appropriate bonding agent does notexist when producing at least one of the structures using apolypropylene resin. Therefore, bonding strength may be low, or amicrostructure may be deformed when employing a high heatingtemperature.

When producing a microproduct without a channel such as a microwellarray chip, it may be necessary to provide a liquid leakage preventiveframe around the well array so that leakage of a sample poured into thewell array does not occur. In this case, a solvent or the like may enterthe space between the bonding surfaces of the microwell array chip andthe liquid leakage preventive frame, whereby leakage of a liquid mayoccur.

SUMMARY

According to one aspect of the invention, there is provided a bondedstructure comprising a first structure and a second structure, the firststructure and the second structure having opposed bonding surfaces, atleast one of the first structure and the second structure being formedof a resin composition including a polypropylene resin and ahydrogenated derivative of a block copolymer of the following generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block), and thebonding surfaces being bonded by heating an alkoxysilane or alkylsilanecompound applied to the bonding surface of at least one of the firststructure and the second structure.

According to another aspect of the invention, a microstructure maycomprise an open microstructure in at least one bonding surface of theabove bonded structure.

According to a further aspect of the invention, a microproduct maycomprise N structures (N is an integer equal to or larger than three).

According to a further aspect of the invention, there is provided amicroproduct used for biochemistry or biotechnology, the microproductbeing formed of the above resin composition and comprising a channelgroove with a width and a depth each having 0.3 to 200 μm.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 shows structure bonding results.

FIG. 2 shows permeation test results of a silane compound into astructure.

FIG. 3 shows an example of a microstructure.

FIG. 4 shows an example of a microproduct.

FIGS. 5A to 5C shows micrographs of bonding surfaces.

FIG. 6 shows a sample subjected to T-peeling bonding strengthevaluation.

FIG. 7 shows peeling force evaluation results.

FIG. 8 shows an example in which structures are bonded.

FIGS. 9A and 9B show the flow of a liquid containing cells.

DETAILED DESCRIPTION OF THE EMBODIMENT

In view of the above background art, an objective of the invention is toprovide a bonded structure exhibiting excellent bondability of bondingsurfaces of a plurality of structures, a microstructure, and amicroproduct.

According to one embodiment of the invention, there is provided a bondedstructure comprising a first structure and a second structure, the firststructure and the second structure having opposed bonding surfaces, atleast one of the first structure and the second structure being formedof a resin composition including a polypropylene resin and ahydrogenated derivative of a block copolymer of the following generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block), and thebonding surfaces being bonded by heating an alkoxysilane or alkylsilanecompound applied to the bonding surface of at least one of the firststructure and the second structure.

According to another embodiment of the invention, there is provided amicrostructure comprising a first structure and a second structure, thefirst structure and the second structure having opposed bonding surfacesand an open microstructure formed in at least one of the bondingsurfaces, at least one of the first structure and the second structurebeing formed of a resin composition including a polypropylene resin anda hydrogenated derivative of a block copolymer of the following generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block), and thebonding surfaces being bonded by heating an alkoxysilane or alkylsilanecompound applied to the bonding surface of at least one of the firststructure and the second structure.

The open microstructure formed in the bonding surface is selecteddepending on the application such as a microbioreactor. The term “openmicrostructure” used herein refers to a channel groove, a depression, orthe like having a width and a depth of about 0.3 to 200 μm. Thestructure according to the invention is effectively applied to amicrostructure having dimensions of 1 to 50 μm.

As the polypropylene resin, a polypropylene homopolymer or apolypropylene random copolymer including an α-olefin such as ethylene,butene-1, or hexene-1 may be used.

As examples of the polymer block X, a polymer produced by polymerizingvinyl aromatic monomers (e.g. styrene), ethylene, methacrylate (e.g.methyl methacrylate), or the like can be given.

The hydrogenated derivative of the block copolymer of the generalformula X-Y includes copolymers shown by (X-Y)_(n) (n=1 to 5), X-Y-X,Y-X-Y, and the like.

As examples of the polymer block X of the hydrogenated derivative, apolystyrene polymer block and a polyolefin polymer block can be given.As examples of the polystyrene polymer block, a polymer block includingone or more vinyl aromatic compounds selected from styrene,α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene,2,4-dimethylstyrene, vinylnaphthalene, and vinylanthracene as themonomer unit can be given.

As examples of the polyolefin polymer block, copolymers of ethylene andan α-olefin having 3 to 10 carbon atoms can be given.

A nonconjugated diene may be polymerized in the polymer block.

As examples of the olefin, propylene, 1-butene, 3-methyl-1-butene,1-pentene, 4-methyl-1-pentene, 1-hexene, 1-pentene, 1-octene, 1-decene,and the like can be given.

As examples of the nonconjugated diene, 1,4-hexadiene,5-methyl-1,5-hexadiene, 1,4-octadiene, cyclohexadiene, cyclooctadiene,cyclopentadiene, 5-ethylidene-2-norbornene, 5-butylidene-2-norbornene,2-isopropenyl-5-norbornene, and the like can be given.

As specific examples of the copolymer, an ethylene-propylene copolymer,an ethylene-1-butene copolymer, an ethylene-1-octene copolymer, anethylene-propylene-1,4-hexadiene copolymer, anethylene-propylene-5-ethylidene-2-norbornene copolymer, and the like canbe given.

As examples of the polymer block Y before hydrogenation, polybutadieneincluding at least one group selected from the group consisting of a2-butene-1,4-diyl group and a vinylethylene group as the monomer unit,and polyisoprene including at least one group selected from the groupconsisting of a 2-methyl-2-butene-1,4-diyl group, an isopropenylethylenegroup, and a 1-methyl-1-vinylethylene group as the monomer unit can begiven.

As another example of the polymer block Y before hydrogenation, anisoprene-butadiene copolymer including an isoprene unit and a butadieneunit as the main monomer units can be given, the isoprene unit being atleast one group selected from the group consisting of a2-methyl-2-butene-1,4-diyl group, an isopropenylethylene group, and a1-methyl-1-vinylethylene group, and the butadiene unit being a2-butene-1,4-diyl group and/or a vinylethylene group.

The arrangement of the butadiene unit and the isoprene unit may be arandom arrangement, a block arrangement, or a tapered block arrangement.

As still another example of the polymer block Y before hydrogenation, avinyl aromatic compound-butadiene copolymer including a vinyl aromaticcompound unit and a butadiene unit as the main monomer units can begiven, the vinyl aromatic compound unit being at least one monomer unitselected from styrene, α-methylstyrene, o-methylstyrene,m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, vinylnaphthalene,and vinylanthracene, and the butadiene unit being a 2-butene-1,4-diylgroup and/or a vinylethylene group.

The arrangement of the vinyl aromatic compound unit and the butadieneunit may be a random arrangement, a block arrangement, or a taperedblock arrangement.

The hydrogenation state of the polymer block Y may be partialhydrogenation or complete hydrogenation.

The raw materials are easily available if the polymer block X of thehydrogenated derivative is polystyrene and the polymer block Y beforehydrogenation is 1,2-polyisoprene, 3,4-polyisoprene, and/or1,4-polyisoprene.

Since the styrene component is immiscible with the polypropylene resinor the like, a longer period of time is required to mix the styrenecomponent with polypropylene as the amount of styrene component isincreased. Therefore, when using a hydrogenated derivative containing alarge amount of styrene component, it is preferable to sufficiently mixthe styrene component and polypropylene in advance to prepare amasterbatch.

The raw materials are also easily available if the polymer block X ofthe hydrogenated derivative is polystyrene and the polymer block Ybefore hydrogenation is 1,2-polybutadiene and/or 1,4-polybutadiene.

The alkoxysilane or alkylsilane compound is shown by the followingstructural formulas.

R₁ represents hydrogen, nitrogen, or a linear or branched alkyl group oralkenyl group.

R₁ may have a terminal functional group. When R₁ is an alkyl group whichdoes not have a terminal functional group, the alkoxysilane oralkylsilane compound exhibits high permeability into a bonding surfaceformed by a resin composition having a low crystallinity and includingthe polypropylene resin and the hydrogenated derivative of the blockcopolymer of the general formula X-Y, whereby bonding strength isincreased.

R₂ and R₃ represent alkyl groups having about 1 to 3 carbon atoms, andn, n′, m, and m′ represent 0, 1, 2, or 3, provided that n+m=3 andn′+m′=3.

R₄ represents an alkylene group, and may be a group in which twoalkylene groups are bonded through a functional group.

The alkoxysilane or alkylsilane compound functions as an adhesive.

Bonding strength is improved by adding the hydrogenated derivative ofthe block copolymer of the general formula X-Y (X is a polymer blockimmiscible with the polypropylene resin, and Y is a conjugated dieneelastomer polymer block) to the adhesive formed of the alkoxysilane oralkylsilane compound and dissolving the derivative in the adhesive.

According to another embodiment of the invention, a microproduct mayinclude N structures (N is an integer equal to or larger than three).

In this case, the structure and the silane compound illustrated for themicrostructure may be applied.

At least one of the N structures may be formed of a polypropylene resinand a hydrogenated derivative of a block copolymer of the generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block) (hereinaftermay be called “structure resin composition”). In this case, bondabilitywith the structure resin compositions forming the opposed bondingsurfaces is improved by adding a hydrogenated derivative of a blockcopolymer of the general formula X-Y (hereinafter called “bondingelastomer”) to the alkoxysilane or alkylsilane compound and dissolvingthe derivative in the compound, whereby bonding strength is furtherimproved.

The method of molding the structure resin composition is notparticularly limited. It is preferable to use injection molding or thelike exhibiting a low resin orientation.

The structure resin composition including the polypropylene resin andthe hydrogenated derivative of the block copolymer of the generalformula X-Y (elastomer) exhibits excellent wettability with awater-soluble liquid due to hydrophilicity, allows a liquid containingcells injected into a channel to flow advantageously, and exhibitsexcellent applicability to a microstructure. Since the silane compoundis caused to permeate or adhere to the bonding surfaces of thestructures and the bonding surfaces are bonded by heating, an excellentmicrostructure and microproduct are obtained in which leakage of liquidis prevented.

When the structures to be bonded are formed of the structure resincomposition, bonding strength is further improved by adding the bondingelastomer to the silane compound.

According to a further embodiment of the invention, there is provided amicroproduct used for biochemistry or biotechnology, the microproductbeing formed of a resin composition including a polypropylene resin anda hydrogenated derivative of a block copolymer of the following generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block), andcomprising a channel groove with a width and a depth each having 0.3 to200 μm.

A resin composition was prepared using a polypropylene resin randomcopolymer (J-3021GR for injection molding manufactured by Idemitsu KosanCo., Ltd., MFR: 33 g/10 min, density: 0.9 g/cm³, Young's modulus: 1000MPa, flexural modulus of elasticity: 1000 MPa, Rockwell hardness: 76R)and a hydrogenated derivative (Hybrar 7311S manufactured by Kuraray Co.,Ltd., hydrogenated polystyrene-vinyl-polyisoprene-polystyrene blockcopolymer, styrene content: 12 wt %) as a second synthetic resincomponent while changing the mixing ratio, and a bondability evaluationtest sample shown in FIG. 3 was injection-molded.

The test sample was formed by bonding a first structure 1 and a secondstructure 2 under various conditions.

A channel 1 with a depth of 50 μm, a width of 50 μm, and a length of 14mm, an ink injection section 1 a, and an ink storage section 1 b wereformed in the first structure, and an ink injection port 2 a and an inkstorage section 2 b were formed in the second structure 2 correspondingto the structure 1.

The microstructure thus produced was evaluated as follows.

Specifically, red ink (Xstamper refill manufactured by Shachihata Inc.)was injected through the ink injection section 1 a and caused to flowtoward the ink storage section through the channel. A channel breakagepressure at which the ink leaked into the bonded section (schematicallyindicated by ink leakage 3 in FIG. 3) was measured.

The evaluation results are shown in FIG. 1.

Bondability was evaluated by the spread state of a test liquidcontaining an alcohol and ink at a mixing ratio of 50:50 (%).

-   Rank 0: Ink spreads within one day through natural streaming.-   Rank 1: Ink spreads within one to seven days through natural    streaming.-   Rank 2: Ink does not spread within seven days through natural    streaming.-   Rank 3: Ink spreads at a liquid pressure of 0.2 MPa or more and less    than 0.4 MPa.-   Rank 4: Ink spreads at a liquid pressure of 0.4 MPa or more and less    than 0.6 MPa.-   Rank 5: Ink spreads at a liquid pressure of 0.6 MPa or more and less    than 0.8 MPa.-   Rank 6: Ink does not spread when repeatedly conducting the test    about five times at a liquid pressure of 0.6 MPa.-   Rank 7: Ink does not spread when repeatedly conducting the test 10    times or more at a liquid pressure of 0.6 MPa.-   Rank 8: Ink does not spread when repeatedly conducting the test 20    times or more at a liquid pressure of 0.6 MPa.

FIG. 2 shows the evaluation results of a permeation test of a silanecompound into a structure. In the permeation test, a change in weight ofthe structure before and after immersing the structure in the silanecompound was measured. The higher the weight increase rate, the higherthe permeability.

The structure used for the permeation test contained a hydrogenatedderivative (elastomer) in an amount of 50%.

In FIG. 1, when bonding the structures immediately after molding, thebondability evaluation was the Rank 0 at a hydrogenated derivativemixing ratio of 20% or less. Bondability was improved by drying thestructures before bonding.

It suffices that ink does not spread in a normal microstructure throughnatural streaming (Rank 1). It is preferable that the microstructurehave the Rank 2 or more, and ideally the Rank 5 or more from theviewpoint of reliability.

Therefore, the mixing ratio of the hydrogenated derivative may be 5 to70% in practice. The mixing ratio of the hydrogenated derivative ispreferably 30 to 66%.

As shown in FIG. 2, it was found that the silane compounds having highpermeability into the bonding surface formed by the structure resincomposition, such as hexamethyldisilazane and isobutyltrimethoxysilane,exhibit excellent bondability.

FIGS. 5A to 5C show micrographs of the bonding surfaces of thestructures 1 and 2 of the sample number 10 (bondability rank: 8) shownin FIG. 1. FIG. 5B is a photograph showing a state in which the bondingsurfaces shown in FIG. 5A were separated to a distance of about 5 μm.Specifically, the bonding surfaces were separated so that the surface ofthe structure resin composition was partially stretched. FIG. 5C is aphotograph of the surface of the separated structure taken at an angleof about 45°.

FIG. 4 shows an example of a combination of a microwell array chip and aliquid leakage preventive frame as a microproduct.

FIG. 4 shows an example in which a microwell array chip 11 in which amicrowell region 11 a is formed and a liquid leakage preventive frame 12in which an opening 12 a is formed are bonded using a silane compound.

Several hundreds to several millions of microwells with a diameter of 10to 30 μm and a depth of 10 to 20 μm are arranged at a pitch of 15 to 30μm.

Leakage of a test liquid was reliably prevented by bonding the liquidleakage preventive frame 12 to the microwell array chip 11 using thesilane compound.

Since the liquid leakage preventive frame 12 can be bonded to themicrowell array chip 11 using the silane compound, leakage of a testliquid placed in the opening 12 a does not occur. A chip holder 10installed in a detection device such as a microscope is not particularlylimited insofar as the microwell array chip 11 can be positioned. Aslide or a holder made of a resin or a metal may be used as the chipholder 10. The microwell array chip 11 and the chip holder 10 may bebonded using the silane compound.

The chip holder 10 may also be used for a transmission detection deviceby forming an opening 10 a indicated by an imaginary line in the chipholder 10.

The results in which bonding strength was evaluated by peeling force aregiven below.

As shown in FIG. 6, a first structure 10 and a second structure 11 werebonded using a silane compound or a mixture obtained by adding a bondingelastomer to a liquid silane compound.

The tensile T-peeling force was evaluated from one side of the resultingspecimen.

The results are shown in FIG. 7.

(Measuring Instrument)

Digital force gauge BS-20R manufactured by Imada Co., Ltd.

(Measuring Method)

The T-peeling force of the second structure with a length of 21 mm, awidth of 21 mm, and a thickness of 0.6 mm was measured.

(Material for Structure)

As the structure resin composition for the first and second structures,a resin composition prepared by mixing J-3021GR and the elastomer Hybrar7311S at a ratio of 1:1 was used.

Liquid isobutyltrimethoxysilane was used as the silane compound. Hybrar7311S (graph A) or Dynaron 1321P manufactured by JSR Corporation(hydrogenated polystyrene-butadiene, styrene content: 10%) (graph B)were dissolved in the silane compound as the elastomer while changingthe mixing ratio (mass %). After applying the resulting solution to thebonding surface, the solution was allowed to dry for about 10 minutes,heated at 110° C. for about two hours, and allowed to cool. The peelingforce was then measured. The graph in FIG. 7 shows the peeling forcemeasurement results.

It was confirmed that bonding strength was improved by adding thebonding elastomer to the silane compound.

In the invention, although a practical bonding strength can be obtainedwithout adding the bonding elastomer, it is preferable to add thebonding elastomer to the silane compound. The bonding elastomer isdissolved in isobutyltrimethoxysilane at 50° C. to a concentration ofabout 25 mass %.

The amount of bonding elastomer added is preferably 5% or more from theviewpoint of the effect of addition. If the amount of bonding elastomeradded is too great, the viscosity of the solution is increased. Theamount of bonding elastomer added is preferably 15% or less from theviewpoint of applicability.

FIG. 8 shows an application example of the structure according to theinvention. FIG. 8 shows an example of a structure including N structures(N is an integer equal to or larger than three) and (N-1) bondingsurfaces.

A reaction channel, a reaction chamber 51, and the like are formed usingstructures 22, 23, and 24. The bonding surfaces of the structures 22,23, and 24 are bonded through bonding layers 31, 32, and 33 according tothe invention together with a cover structure 21. A liquid inlet tube 41and outlet tubes 43 and 44 are attached to the three-dimensionalstructure. These tubes may also be formed of the structure resincomposition.

Note that FIG. 8 schematically shows a thick bonding layer.

FIG. 9A shows an example of a photograph showing a state in which mouseB lymphocytes c (number of cells: 1×10⁷ cells/mL) are allowed to flowtogether with a cell fluid (10% FCS, RPMI buffer) through a channel(50×50 μm) in a bonded structure produced using the structure resincomposition without applying pressure.

FIG. 9B schematically shows a section around a liquid surface f.

The individual B lymphocytes are uniformly dispersed without adhering tothe channel wall, and a liquid surface f forms a depressed surface withrespect to the flow direction.

Therefore, the invention is suitable for a microproduct which handlescells.

According to the invention, even if a minute microwell, microchannel, orthe like is formed in the bonding surfaces of the structures, thestructures can be bonded while maintaining the microstructure. Moreover,the structure according to the invention exhibits excellent wettabilitywith a cell fluid. Therefore, the invention is suitably applied to amicrostructure and a microproduct used in the fields of biochemistry,biotechnology, optics, electronics, and the like.

Although only some embodiments of the invention have been describedabove in detail, those skilled in the art would readily appreciate thatmany modifications are possible in the embodiments without materiallydeparting from the novel teachings and advantages of the invention.Accordingly, such modifications are intended to be included within thescope of the invention.

1. A bonded structure comprising a first structure and a secondstructure, the first structure and the second structure having opposedbonding surfaces, at least one of the first structure and the secondstructure being formed of a resin composition including a polypropyleneresin and a hydrogenated derivative of a block copolymer of thefollowing general formula X-Y (X is a polymer block immiscible with thepolypropylene resin, and Y is a conjugated diene elastomer polymerblock), and the bonding surfaces being bonded by heating an alkoxysilaneor alkylsilane compound applied to the bonding surface of at least oneof the first structure and the second structure.
 2. The bonded structureas defined in claim 1, wherein the alkoxysilane or alkylsilane compoundapplied to the bonding surface includes the hydrogenated derivative ofthe block copolymer of the general formula X-Y.
 3. A microstructurecomprising a first structure and a second structure, the first structureand the second structure having opposed bonding surfaces and an openmicrostructure formed in at least one of the bonding surfaces, at leastone of the first structure and the second structure being formed of aresin composition including a polypropylene resin and a hydrogenatedderivative of a block copolymer of the following general formula X-Y (Xis a polymer block immiscible with the polypropylene resin, and Y is aconjugated diene elastomer polymer block), and the bonding surfacesbeing bonded by heating an alkoxysilane or alkylsilane compound appliedto the bonding surface of at least one of the first structure and thesecond structure.
 4. The microstructure as defined in claim 3, whereinthe polymer block X of the hydrogenated derivative is polystyrene, andthe polymer block Y of the hydrogenated derivative before hydrogenationis 1,2-polyisoprene, 3,4-polyisoprene, and/or 1,4-polyisoprene.
 5. Themicrostructure as defined in claim 4, wherein the alkoxysilane oralkylsilane compound applied to the bonding surface is an alkoxysilaneor alkylsilane compound having a silane coupling substituent exhibitingpermeability into the bonding surface formed by the resin composition.6. The microstructure as defined in claim 4, wherein the alkoxysilane oralkylsilane compound applied to the bonding surface includes thehydrogenated derivative of the block copolymer of the general formulaX-Y.
 7. The microstructure as defined in claim 3, wherein the polymerblock X of the hydrogenated derivative is polystyrene, and the polymerblock Y of the hydrogenated derivative before hydrogenation is1,2-polybutadiene and/or 1,4-polybutadiene.
 8. The microstructure asdefined in claim 7, wherein the alkoxysilane or alkylsilane compoundapplied to the bonding surface is an alkoxysilane or alkylsilanecompound having a silane coupling substituent exhibiting permeabilityinto the bonding surface formed by the resin composition.
 9. Themicrostructure as defined in claim 7, wherein the alkoxysilane oralkylsilane compound applied to the bonding surface includes thehydrogenated derivative of the block copolymer of the general formulaX-Y.
 10. The microstructure as defined in claim 3, wherein thealkoxysilane or alkylsilane compound applied to the bonding surface isan alkoxysilane or alkylsilane compound having a silane couplingsubstituent exhibiting permeability into the bonding surface formed bythe resin composition.
 11. The microstructure as defined in claim 10,wherein the alkoxysilane or alkylsilane compound applied to the bondingsurface includes the hydrogenated derivative of the block copolymer ofthe general formula X-Y.
 12. The microstructure as defined in claim 3,wherein the alkoxysilane or alkylsilane compound applied to the bondingsurface includes the hydrogenated derivative of the block copolymer ofthe general formula X-Y.
 13. A microproduct comprising N structures (Nis an integer equal to or larger than three), the N structures havingopposed bonding surfaces, at least one of the N structures being formedof a resin composition including a polypropylene resin and ahydrogenated derivative of a block copolymer of the following generalformula X-Y (X is a polymer block immiscible with the polypropyleneresin, and Y is a conjugated diene elastomer polymer block), and thebonding surfaces being bonded by heating an alkoxysilane or alkylsilanecompound applied to at least one of the bonding surfaces.
 14. Themicroproduct as defined in claim 13, wherein the polymer block X of thehydrogenated derivative is polystyrene, and the polymer block Y of thehydrogenated derivative before hydrogenation is 1,2-polyisoprene,3,4-polyisoprene, and/or 1,4-polyisoprene.
 15. The microproduct asdefined in claim 13, wherein the polymer block X of the hydrogenatedderivative is polystyrene, and the polymer block Y of the hydrogenatedderivative before hydrogenation is 1,2-polybutadiene and/or1,4-polybutadiene.
 16. The microproduct as defined in claim 13, whereinthe alkoxysilane or alkylsilane compound applied to the bonding surfaceis an alkoxysilane or alkylsilane compound having a silane couplingsubstituent exhibiting permeability into the bonding surface formed bythe resin composition.
 17. The microproduct as defined in claim 13,wherein the alkoxysilane or alkylsilane compound applied to the bondingsurface includes the hydrogenated derivative of the block copolymer ofthe general formula X-Y.
 18. The microproduct as defined in claim 13,further comprising an open microstructure formed in at least one of thebonding surfaces.